Microscopy

 

To understand why a material has certain properties, we analyse its microstructure. Through our microscopes we can look at the shape and size of the grains, phase composition and presence of defects. We have two very advanced electron microscopes (TESCAN LYRA3 and JEOL JSM7001F). In addition, we also have a number of optical microscopes.

2D and 3D imaging and analysis (FIB/SEM)

One of our microscopes is a dual-beam electron microscope (FIB/SEM) capable of 2D and 3D imaging and analysis. The system is equipped with a universal vacuum system, which makes it easy to analyse any kind of material, including metallic and nonconductive materials. Add-on detectors/systems have been chosen specifically for in-depth studies in the field of materials science and metallurgy.

Technical details

Hardware (EDAX package):

  • Electron Backscatter Diffraction (EBSD); Hikari Plus (up to 1000 indexed points/sec)
  • Energy Dispersive Spectrometry (EDS); Octane Plus (res. 127 eV for Mn)
  • Wavelength Dispersive Spectroscopy (WDS); TEXS HP
  • Scanning Transmission Electron Microscopy (STEM); BF,DF, HADF (res. down to 0.8 nm)
  • Focused Ion Beam (FIB); COBRA (res. down to 2.5 nm)
  • 4 Quadrant Backscatter Solid State Detector (4QBSE)
  • Water-cooled BSE detector; for in-situ high temperature applications
  • Nanomanipulator; Oxford OmniProbe200
  • Beam Deceleration Mode; for low kV applications
  • In-beam BSE
  • In-beam Secondary Electron (SE)
  • Low vacuum SE
  • Plasma Cleaning system
  • Field Cancellation System
  • In-situ tensile/compression/heating stage, adaptable for in-situ EBSD applications (up to 5kN and 800°C) + extensometer; K&W

Software packages:

  • Advanced tomography
  • Automated TEM lamella preparation
  • MeX Professional 3D surface imaging; Alicona
  • 3D reconstruction; ORS Visual
  • TEAM complete package + Particle analysis; EDAX; 2D and 3D
  • TSL-OIM complete package
  • CORAL for correlative microscopy
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Field Emission Scanning Electron Microscope

Our second electron microscope is a high performance thermal field emission scanning electron microscope (FESEM). Add-on detectors/systems have been chosen specifically for in-depth studies in the field of materials science and metallurgy.

Technical details

Detectors:

  • EDAX package:
    • Electron Backscatter Diffraction (EBSD); Hikari Pro (up to 600 indexed points/sec)
    • Energy Dispersive Spectrometry (EDS); Octane Pro, 10 mm2 (res. 129 eV for Mn)
    • Wavelength Dispersive Spectroscopy (WDS); TEXS
  • Scanning Transmission Electron Microscopy (STEM); BF and DF (res. down to 1.2 nm)
  • Backscatter Detector (BE)

Accessories:

  • Field Cancellation System
  • In-situ tensile/heating stage, adaptable for in-situ EBSD applications (up to 1.1kN and 400°C); TSL

Software packages:

  • TEAM complete package + Particle analysis; EDAX
  • TSL-OIM complete package


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Content updated 2017-08-15

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